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Bxinp_2024-03_Framework Agreement For The Provision Of Multi-Project Wafer Manufacturing Services (Mpw) In The Field Of Integrated Circuits For Prototyping Within The Framework Of Research And

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General Information
   Aug 26, 2024
   French
   Other
   published: Aug 26, 2024

Original Text

Avis n° 24-96350






Publié le 22 août 2024















BxINP_2024-03_Accord-cadre de prestation de services de fabrication de plaquettes multi-projet (MPW) dans le domaine des circuits intégrés pour le prototypage dans le cadre de projets de recherche et








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Acheteur : Institut Polytechnique de Bordeaux



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